Resin Designs TechFilm is a product line consisting of high performance, partially cured epoxy adhesive films. These special film adhesives are designed to replace two-component liquid epoxy resins. Techfilm's benefits include clean, precise bonding thicknesses and boundaries, high and low temperatures, and tolerance to harsh environmental conditions.  

What makes these films different from traditional adhesive coatings? Let's review the unique benefits of TechFilm adhesives and discuss how best to implement their unique application process.

What is film based adhesive?

TechFilm products can be treated as Class b adhesives, meaning that they are partially cured in the form of a film, which is interrupted by subsequent storage, packaging and transportation of the frozen film material. Grade B epoxy film is superior to epoxy resin provided in liquid form because it can be applied cleanly and precisely to the desired location. Its ability to die cut into complex shapes contributes to high precision.

Another significant advantage of Techfilm products is that they can include thermal or conductive materials as needed. If supplied with such a high filler content, the liquid epoxy will have sedimentation and clogging problems. Techfilm bonding can fully cure in minutes with moderate heat and pressure, while similar liquid epoxies can take hours or even days. Our top polymer scientists have designed this material to achieve superior wettability and adhesion on common industrial substrates, including most metals and plastics.

How to apply TechFilm Adhesive

TechFilm has a wide range of applications, including aerospace, automotive and medical. It is also used to manufacture electronic devices, IC packages and other high-tech products. To apply TechFilm products, the following materials are required:

· TechFilm products

· Base material

· Pressure applicator

· Curing furnace

Once you have these elements in place, you can begin to apply them.

4 steps to apply TechFilm adhesive

1. Remove TechFilm products from refrigeration. Let it return to room temperature.

2. Apply TechFilm products to the required substrate.

3. Apply pressure to the bonding area using a pressure applicator. The amount of pressure required depends on the thickness of the TechFilm product and the base material.

4. Solidify the bonding area in the oven at the specified temperature and time.

Pressure applicator options:

Self-weight: one of the best ways to apply pressure to the bonded area. They should be preheated to curing temperature before use. Pressures from 0.1 psi to 100 psi have been successfully used. Generally, 1-5 psi during curing works best.

Autoclave bag bonding: Autoclave bag bonding is a very effective method of applying pressure and heat to the bonded area. It is the best choice to ensure no gap bonding. Gluing using a dead weight or other pressure application method in the autoclave will also reduce the size of the gap.

Spring clamp: Spring clamp can provide a constant force during the curing cycle, but it is not as effective as the self-weight or autoclave bag bonding method.

· Screw clamp: Screw clamp is not recommended for applying pressure to the bonding area. As the adhesive flows during the curing process, the force exerted by the screw clamp will be reduced.

Vacuum bag bonding method: Vacuum bag bonding method is not recommended for curing TechFilm products. The low pressure and high temperature of a vacuum furnace can cause the adhesive to evaporate. This is because the adhesive may not fully wet all surfaces when the void is exposed to a vacuum. However, the use of the vacuum bag method in applications where rough surfaces are wetted at 70 to 80 ° C is very helpful in producing a voidless bonding.

Curing temperature and time:

The curing temperature and time of TechFilm products depend on the thickness of the film and base material. Refer to the manufacturer's instructions for specific recommendations.

Troubleshooting for TechFilm adhesive applications:

· If the bond is not strong, it may be necessary to apply more pressure or take longer to cure the bond area.

· If there are gaps in the bonding, it may be necessary to use a different pressure applicator or to cure the bonding area in an autoclave.

Safety considerations for film adhesives:

· TechFilm products shall be frozen and stored in a dry place before use.

· It is important to wear gloves and goggles when using TechFilm products.

Conclusion:

Resin Designs TechFilm products are an excellent alternative to liquid epoxy resins with many advantages. It enables clean, fast and efficient bonding of a wide range of substrates with complex shape capabilities and additional features such as high levels of thermal or electrical conductivity.

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